Copper alloy

Patent Pending Provided is a copper alloy with an FCC structure, said copper alloy containing 3.0 to 29.5 mass% of Ni, 0.5 to 7.0 mass% of Al, and 0.1 to 1.5 mass% of Si, with the remainder comprising Cu and unavoidable impurities. By precipitating, at an average particle size of not more than 100 nm, an Si-containing L12-structured ?' phase in the parent phase of the copper alloy, the copper alloy is provided with excellent processability even at high temperatures, and is highly conductive. Furthermore, these characteristics can be controlled.