Magnetron sputtering apparatus

Patent Granted In a conventional magnetron sputtering apparatus in which a magnetic field pattern on a surface of a target is moved with time by a group of rotary magnets, the defect rate of substrate is increased upon ignition or extinction of plasma. In order to remove the above-mentioned problem, it is an object of this invention to provide a magnetron sputtering apparatus having a low defect rate of substrates as compared with the conventional apparatus.