Electronics
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Semiconductor device

Patent Granted PROBLEM TO BE SOLVED: To reduce remaining metal and its oxide in a wiring and to suppress an increase in wiring resistance when a seed layer is formed along a top surface of an insulating film and a recessed portion of an insulating film to bury a copper wiring in the recessed portion, then a barrier film is formed by heating, and a surplus of the metal forming the seed layer is removed.

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