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Patent Granted A multilayered circuit board which is provided with a low-permittivity interlayer insulating film, and which can significantly improve the performance such as signal transmission characteristics of the multilayered circuit board such as a package and a printed board, because the surface in contact with the interlayer insulating film of the circuit board has no unevenness to eliminate the loweringof production yield and the deterioration of high-frequency signal transmission characteristics; and electronic equipment using the circuit board.
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