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Patent Granted PROBLEM TO BE SOLVED: To reduce size, and improve performance, such as broadband performance. ; SOLUTION: A first wiring pattern 200 comprises terminals A, C and a first C-shaped line pattern 2 connecting the terminals A, C. A second wiring pattern 300 comprises terminals D, F and a second C-shaped line pattern 3 connecting the terminals D, F. The first and second line patterns 2, 3 are laminated via a planar dielectric 1 so that openings do not overlap while being shifted each other by 180[deg.].
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