Copper powder

Patent Granted PROBLEM TO BE SOLVED: To provide copper powder applicable to the use for wiring and electronic components, and in which corrosion is extremely hard to occur, i.e., the surface oxidation of grains is extremely hard to occur. ; SOLUTION: The copper powder having excellent dispersibility in liquid and corrosion resistance is composed of copper grains with the average grain size of <=200 nm, in which an organic polymer soluble in alcohol or water such as a polymer of 1-vinyl-2-pyrrolidone is stuck to the surface of a metal copper phase.