Prober

Patent Pending PROBLEM TO BE SOLVED: To solve the problem that a difference between thermal expansion coefficients of a probe card and a silicon wafer is remarkable and the position of a probe to an electrode pad is deviated when performing a burn-in test while the large size of a semiconductor wafer and the large size of a probe substrate accompanying high density of a semiconductor integrated circuit, and the reduction of arrangement pitches of the probe in inspection of the newest semiconductor integrated circuit.