Joined body

Patent Granted PROBLEM TO BE SOLVED: To provide a joined body whose members to be joined are uniformly joined by improving wettability when using a soldering material having Bi as a main composition. ; SOLUTION: The joined body whose two components are joined with each other by a soldering material having Bi as a main composition each other has a Cu layer on each joined surface of the two components, and a film containing at least one of Pd and Ni is formed on the surface of the Cu layer, and the film vanishes after joining.