Laser Beam Machining

Patent Pending Laser beam machining (LBM) is an unconventional machining process in which a laser is directed towards the work piece for machining. Since the rays of a laser beam are monochromatic and parallel it can be focused to a very small diameter and can produce energy as high as 100 MW of energy for a square millimeter of area. It is especially suited to making accurately placed holes. It can be used to perform precision micro-machining on all microelectronic substrates such as ceramic, silicon, diamond, and graphite. Examples of microelectronic micro-machining include cutting, scribing & drilling all substrates, trimming any hybrid resistors, patterning displays of glass or plastic and trace cutting on semiconductor wafers and chips. A pulsed ruby laser is normally used for developing a high power.