Precisely machined micro devices

Patent Pending Unlike Bulk micromachining, where a silicon substrate (wafer) is selectively etched to produce structures, surface micromachining builds microstructures by deposition and etching of different structural layers on top of the substrate.[1] Generally polysilicon is commonly used as one of the layers and silicon dioxide is used as a sacrificial layer which is removed or etched out to create the necessary void in the thickness direction.