Adhering two layers of materials

Patent Granted Adhesive bonding (also referred to as gluing or glue bonding) describes a wafer bonding technique with applying an intermediate layer to connect substrates of different materials. These produced connections can be soluble or insoluble.[1] The commercially available adhesive can be organic or inorganic and is deposited on one or both substrate surfaces. Adhesives especially the wide established SU-8 and Benzocyclobuten (BCB) are specialized for MEMS or electronic component production.