Thermal interface material

Patent Granted Thermal grease (also called thermal gel, thermal compound, thermal paste, heat paste, heat sink paste, thermal interface material, or heat sink compound) is a kind of thermally conductive (but usually electrically insulating) adhesive, which is commonly used as an interface between heat sinks and heat sources (e.g., high-power semiconductor devices). The grease gives a mechanical strength to the bond between the heat sink and heat source, but more importantly, it eliminates air (which is a thermal insulator) from the interface area.