Plasma processing device

特許 係属中 Provided is a wiring board plasma-processing device capable of improving throughput and reducing running cost while employing a sputtering process in manufacturing a wiring board. The wiring board plasma-processing device includes, in the same plasma processing chamber, a plasma source, a surface processing unit for performing a pretreatment of a board to be processed, and a plurality of sputtering film formation units for forming a seed layer formed of a plurality of films.