公式タイトルと情報はIP Exchange PlusとPremiumのユーザーのみが利用可能です。
特許 権利維持 Between a first wiring layer and a second wiring layer included in a multilayer wiring structure, a gas or an insulating material having an average dielectric constant not greater than 2.5 is interposed. Between wirings in the first wiring layer and wirings in the second wiring layer, conductive connecting members are arranged.
追加情報の詳細を見るにはIP Exchange PlusまたはIP Exchange Premiumアカウントにアップグレードする必要があります
