3D semiconductor device

特許 係属中 PROBLEM TO BE SOLVED: To provide a three-dimensional structure semiconductor device which prevents an increase in the area of a chip and increases the operation frequency of the chip. ; SOLUTION: The three-dimensional structure semiconductor device comprises a first integrated circuit including a plurality of regions formed in a first semiconductor layer and a first wiring layer formed on the first semiconductor layer, a first insulating layer overlaid on the first wiring layer, and a second integrated circuit including a plurality of regions formed in a second semiconductor layer overlaid on the first insulating layer and a second wiring layer formed on the second semiconductor layer.