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Patent Granted PROBLEM TO BE SOLVED: To provide plating equipment which can accurately form a plating layer having a uniform film thickness. ; SOLUTION: The plating equipment is characterized in that a resistance imparting means 6 for imparting a resistance to a current flowing between an anode 7 and a substrate 8 to be plated serving as a cathode, which are immersed in a plating solution, is provided between the anode 7 and the substrate 8 to be plated.
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